The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2026

Filed:

Sep. 01, 2023
Applicant:

Enkris Semiconductor, Inc., Suzhou, CN;

Inventors:

Liyang Zhang, Suzhou, CN;

Kai Cheng, Suzhou, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 14/20 (2026.01); H10D 62/85 (2025.01); H10D 62/852 (2025.01); H10P 50/24 (2026.01); H10P 14/22 (2026.01); H10P 14/24 (2026.01);
U.S. Cl.
CPC ...
H10P 14/3416 (2026.01); H10D 62/8503 (2025.01); H10D 62/852 (2025.01); H10P 14/2921 (2026.01); H10P 14/3442 (2026.01); H10P 50/242 (2026.01); H10P 14/22 (2026.01); H10P 14/24 (2026.01);
Abstract

Disclosed are a semiconductor structure and a method for manufacturing a semiconductor structure, the method includes: forming a first transition layer, a protection layer and an active structure layer sequentially epitaxially on a side of a growth substrate, where a surface, away from the growth substrate, of the first transition layer is a two-dimensional flat surface; on a first plane, an orthographic projection of the active structure layer is at least partially covered by an orthographic projection of the protection layer, and the first plane is perpendicular to an arrangement direction of the protection layer and the active structure layer; detaching the growth substrate by a laser lift-off process, to make the epitaxial layer transferred to a transfer substrate; etching the first transition layer up to the protection layer, to make a surface, away from the active structure layer, of the protection layer to be a planarization surface.


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