The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2026

Filed:

Mar. 11, 2022
Applicant:

Tetramem Inc., Fremont, CA (US);

Inventors:

Minxian Zhang, Newark, CA (US);

Mingche Wu, Newark, CA (US);

Ning Ge, Newark, CA (US);

Assignee:

TetraMem Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10N 70/00 (2023.01); H10B 63/00 (2023.01); G11C 13/00 (2006.01);
U.S. Cl.
CPC ...
H10N 70/826 (2023.02); H10B 63/30 (2023.02); H10B 63/80 (2023.02); H10N 70/021 (2023.02); H10N 70/063 (2023.02); H10N 70/8833 (2023.02); G11C 13/003 (2013.01); G11C 2213/15 (2013.01); G11C 2213/79 (2013.01);
Abstract

The present disclosure relates to resistive random-access memory (RRAM) devices. A method for fabricating an RRAM device includes: fabricating a first bottom electrode and a second bottom electrode on a substrate; fabricating a first isolation layer on the substrate, the first bottom electrode, and the second bottom electrode; fabricating a via in the first isolation layer to expose a portion of the first bottom electrode; fabricating a switching oxide layer on the first isolation layer and the exposed portion of the first bottom electrode; and fabricating a filament-forming layer by etching a portion of the switching oxide layer that extends beyond the via. The portion of the switching oxide layer does not contact the exposed portion of the first bottom electrode. A top electrode is fabricated on the filament-forming layer. A top metal interconnect may be fabricated on the top electrode and a second isolation layer.


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