The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
Nov. 01, 2023
Tong Hsing Electronic Industries, Ltd., Taipei City, TW;
Li-Chun Hung, Hsin-Chu County, TW;
TONG HSING ELECTRONIC INDUSTRIES, LTD., Taipei City, TW;
Abstract
A semiconductor package structure and a method for producing the same are provided. The package structure includes a support substrate, a chip body disposed on the support substrate, a metal lead connected between the support substrate and the chip body, a spacer element disposed on the chip body, and a light-transmitting plate disposed on the chip body through the spacer element. The chip body, the spacer element, and the light-transmitting plate jointly define a closed space. The package structure further includes an encapsulation colloid formed on outsides of the closed space. The encapsulation colloid is formed by curing a liquid resin encapsulant and includes a plurality of first fillers and a plurality of second fillers dispersed therein. Before the liquid resin encapsulant is cured, a sinking rate of each of the second fillers in the liquid resin encapsulant is less than that of each of the first fillers.