The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2026

Filed:

Jul. 12, 2021
Applicant:

Shin-etsu Handotai Co., Ltd., Tokyo, JP;

Inventors:

Keitaro Tsuchiya, Takasaki, JP;

Masaru Shinomiya, Annaka, JP;

Kosei Sugawara, Nishigo-mura, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 62/85 (2025.01); H01L 21/02 (2006.01); H10D 62/40 (2025.01);
U.S. Cl.
CPC ...
H10D 62/8503 (2025.01); H01L 21/02381 (2013.01); H01L 21/02433 (2013.01); H01L 21/02458 (2013.01); H10D 62/40 (2025.01);
Abstract

The present invention is a nitride semiconductor wafer, including: a silicon single-crystal substrate; and a device layer composed of a nitride semiconductor above the silicon single-crystal substrate, wherein the silicon single-crystal substrate is a CZ silicon single-crystal substrate, and has a resistivity of 1000 Ω·cm or more, an oxygen concentration of 5.0×10atoms/cm(JEIDA) or more and 2.0×1.0atoms/cm(JEIDA) or less, and a nitrogen concentration of 5.0×10atoms/cmor more. This provides a nitride semiconductor wafer that hardly causes plastic deformation even using a high-resistant low-oxygen silicon single-crystal substrate produced by the CZ method, which is suitably used for a high-frequency device, and that can reduce warpage of the substrate.


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