The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2026

Filed:

Jul. 19, 2024
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Marco Sforzin, Cernusco sul Naviglio, IT;

Emanuele Confalonieri, Segrate, IT;

Daniele Balluchi, Milan, IT;

Danilo Caraccio, Milan, IT;

Nicola Del Gatto, Cassina de' Pecchi, IT;

Rishabh Dubey, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 11/10 (2006.01);
U.S. Cl.
CPC ...
G06F 11/1016 (2013.01); G06F 11/1068 (2013.01);
Abstract

Provided in a central controller system, is a system and method to identify and mitigate errors on a die containing mission critical logical-to-physical addressing information. The logical-to-physical (L2P) addressing information is essential for translating logical memory addresses for uncompressed data to physical addresses for compressed data. When a die containing L2P data is detected as being corrupted, the corrupted data is corrected, and all the data is moved to an uncorrupted die at a specified offset from the original address of the die.


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