The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2026

Filed:

Jun. 23, 2022
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Ruilong Xie, Niskayuna, NY (US);

Albert M. Chu, Nashua, NH (US);

Nicholas Anthony Lanzillo, Wynantskill, NY (US);

Lawrence A. Clevenger, Saratoga Springs, NY (US);

Huai Huang, Clifton Park, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76897 (2013.01); H01L 23/5227 (2013.01); H01L 23/5283 (2013.01);
Abstract

Embodiments of the invention include providing interconnects with two-dimensional free zero line end enclosure. A first metal line is formed. A second metal line is connected by a via to the first metal line, the first metal line having a first end with a zero line extension in relation to the via in a first dimension, the second metal line having another first end with a zero line extension in relation to the via in a second dimension perpendicular to the first dimension.


Find Patent Forward Citations

Quick Actions:

Xie, Ruilong. (2026). Interconnect with two-dimensional free zero line end enclosure (U.S. Patent No. 12604716). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12604716

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