The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2026

Filed:

Jun. 29, 2022
Applicant:

Globalfoundries U.s. Inc., Malta, NY (US);

Inventors:

Mark D. Levy, Williston, VT (US);

Qizhi Liu, Lexington, MA (US);

Jeonghyun Hwang, Ithaca, NY (US);

Assignee:

GLOBALFOUNDRIES U.S. Inc., Malta, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10D 30/47 (2025.01); H10D 30/01 (2025.01); H10D 62/85 (2025.01);
U.S. Cl.
CPC ...
H10D 30/475 (2025.01); H10D 30/015 (2025.01); H10D 62/8503 (2025.01);
Abstract

The present disclosure relates to semiconductor structures and, more particularly, to a patterned buried porous layer of semiconductor material and a device over the patterned buried porous layer, and methods of manufacture. The structure includes: a semiconductor substrate includes a patterned buried porous layer within the semiconductor substrate; a semiconductor compound material over the semiconductor substrate and the patterned buried porous layer; and at least one device on the semiconductor compound material. The non-patterned portions of the semiconductor substrate provide a thermal pathway within the semiconductor substrate.


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