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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12599021 B1

PDFFull Text
Date of Patent:
Apr. 07, 2026

Filed:

Sep. 24, 2021

Homogenous die stacking with increased element density

Applicant:

Altera Corporation, San Jose, CA (US);

Inventors:

Mahesh K. Kumashikar, Bangalore, IN;

Dheeraj Subbareddy, Portland, OR (US);

Ankireddy Nalamalpu, Portland, OR (US);

MD Altaf Hossain, Portland, OR (US);

Atul Maheshwari, Portland, OR (US);

Assignee:

Altera Corporation, San Jose, CA (US);

Attorney:

Fletcher Yoder, P.C.

Primary Examiner:

Jasmine J Clark

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); H01L 23/481 (2013.01); H01L 24/81 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2224/16146 (2013.01); H01L 2225/06513 (2013.01);
Abstract

An integrated circuit device includes multiple microbumps and a top programmable fabric die including a first programmable fabric and a first microbump interface coupled to the multiple microbumps. The integrated circuit device also includes a base programmable fabric die having a second programmable fabric and a second microbump interface coupled to the first microbump interface via a coupling to the multiple microbumps. The top programmable fabric die and the base programmable fabric die have a same design. Moreover, the top programmable fabric die and the base programmable fabric die are arranged in a three-dimensional die arrangement with the top programmable fabric die flipped above the base programmable fabric die.

Find Patent Forward Citations

Kumashikar, Mahesh. (2026). Homogenous die stacking with increased element density (U.S. Patent No. 12599021). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12599021

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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