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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12593638 B1

PDFFull Text
Date of Patent:
Mar. 31, 2026

Filed:

Jun. 26, 2023

Device wafer processing method

Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Naoko Yamamoto, Tokyo, JP;

Shunsuke Teranishi, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:

Greer, Burns & Crain, Ltd.

Primary Examiner:

Vu A Vu

Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/02 (2006.01); H01L 21/268 (2006.01); H01L 21/683 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/02076 (2013.01); H01L 21/268 (2013.01); H01L 21/6836 (2013.01); H01L 23/544 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68386 (2013.01); H01L 2223/5446 (2013.01);
Abstract

A device wafer processing method includes a protective film coating step of coating a face side of a device wafer with a protective film, a laser processing step of applying a laser beam having a wavelength absorbable by the device wafer to the device wafer along streets and forming laser processing grooves that divide a device layer, a tape affixing step of affixing a tape to the protective film on the device wafer, a holding step of holding the face side of the device wafer by a holding table via the tape and exposing a reverse side of the device wafer, and a cutting step of cutting the device wafer held on the holding table, by a cutting blade from the reverse side along the streets, and dividing the device wafer into individual devices.

Find Patent Forward Citations

Yamamoto, Naoko. (2026). Device wafer processing method (U.S. Patent No. 12593638). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12593638

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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