The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2026

Filed:

Mar. 28, 2023
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Tomohiko Kitajima, San Jose, CA (US);

Ning Li, San Jose, CA (US);

Chang Seok Kang, Santa Clara, CA (US);

Naomi Yoshida, Sunnyvale, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/02 (2006.01); C23C 16/34 (2006.01); C23C 16/36 (2006.01); C23C 16/38 (2006.01); C23C 16/56 (2006.01); H01J 37/32 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32899 (2013.01); C23C 16/0227 (2013.01); C23C 16/342 (2013.01); C23C 16/345 (2013.01); C23C 16/36 (2013.01); C23C 16/38 (2013.01); C23C 16/56 (2013.01); H01L 21/0217 (2013.01); H01L 21/0234 (2013.01); H01L 21/67167 (2013.01); H01J 37/32816 (2013.01); H01J 2237/20278 (2013.01); H01J 2237/332 (2013.01); H01J 2237/335 (2013.01); H01J 2237/336 (2013.01);
Abstract

Methods of manufacturing memory devices are provided. The method comprises pre-cleaning a top surface of a film stack, the film stack comprising alternating layers of a first material layer and a second material layer and having one or more of a memory hole and a slit pattern opening extending through the film stack; exposing the top surface of the film stack to a growth inhibitor; selectively depositing a silicon-containing dielectric layer in a region of the film stack; and densifying the silicon-containing dielectric layer. The processing method is performed in a processing tool without breaking vacuum.


Find Patent Forward Citations

Loading…