The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2026

Filed:

Sep. 25, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company Limited, Hsin-Chu, TW;

Inventors:

Ting-Yu Chiu, Hsinchu County, TW;

Yi-Neng Chang, Hsinchu County, TW;

Shin-Han You, Taoyuan City, TW;

Chien Fang Huang, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); G01R 1/04 (2006.01); G01R 1/067 (2006.01); G01R 1/073 (2006.01); G01R 31/02 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2896 (2013.01); G01R 31/2887 (2013.01); G01R 31/2889 (2013.01); G01R 31/2893 (2013.01);
Abstract

A test system and method of testing are provided. In some embodiments, a system for testing an integrated circuit package includes a device tester. The device tester includes a socket, a cylinder head unit engageable with the socket, and a pressure regulator. The socket includes a first pressure cylinder configured to engage a first region of the integrated circuit package and a second pressure cylinder configured to engage a second region of the integrated circuit package. The pressure regulator is configured to provide at gas at a first pressure to the first pressure cylinder and to provide the gas at a second pressure different than the first pressure to the second pressure cylinder.


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