The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2026

Filed:

Sep. 15, 2020
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Zeyuan Ni, Nirasaki, JP;

Taiki Kato, Nirasaki, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B05D 1/00 (2006.01); B05D 1/32 (2006.01); B05D 3/04 (2006.01); B05D 3/06 (2006.01); B05D 3/10 (2006.01);
U.S. Cl.
CPC ...
B05D 1/60 (2013.01); B05D 1/32 (2013.01); B05D 3/044 (2013.01); B05D 3/067 (2013.01); B05D 3/102 (2013.01); B05D 2202/45 (2013.01); B05D 2401/40 (2013.01);
Abstract

A film forming method includes preparing a substrate having a first region in which a metal film or an oxide film of the metal film is exposed, and a second region in which an insulating film is exposed, supplying, to the substrate, an organic compound containing, in a head group, a triple bond between carbon atoms represented by Chemical Formula (1) described in the specification, causing the organic compound to be selectively adsorbed in the first region among the first region and the second region, and cleaving the triple bond in the first region and forming a hydrophobic film having a honeycomb structure of carbon atoms through polymerization.


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