The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2026
Filed:
Jan. 19, 2022
Intel Corporation, Santa Clara, CA (US);
Nafees A. Kabir, Hillsboro, OR (US);
Kevin L. Lin, Beaverton, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An integrated circuit device includes a first interconnect layer, and a conductive first interconnect feature and a conductive second interconnect feature laterally separated by a body of insulating or semiconductor material. In an example, the first and second interconnect features are above the first interconnect layer. The integrated circuit device further includes a non-conductive feature above and on the first interconnect feature, and a conductive third interconnect feature above and on the second interconnect feature. The integrated circuit device also includes a second interconnect layer above the non-conductive feature and third interconnect features. In an example, the second and third interconnect features conductively couple the first and second interconnect layers.