The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

Jul. 25, 2023
Applicant:

Fei Company, Hillsboro, OR (US);

Inventors:

John Francis Flanagan, Hillsboro, OR (US);

Christopher John Hakala, Hillsboro, OR (US);

Lucas Winiarski, Portland, OR (US);

Assignee:

FEI Company, Hillsboro, OR (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06T 7/13 (2017.01); G01N 23/04 (2018.01); G01N 23/20058 (2018.01); G06T 7/73 (2017.01); G06V 10/82 (2022.01); G06V 20/69 (2022.01);
U.S. Cl.
CPC ...
G06T 7/13 (2017.01); G01N 23/04 (2013.01); G01N 23/20058 (2013.01); G06T 7/73 (2017.01); G06V 10/82 (2022.01); G06V 20/693 (2022.01); G06V 20/695 (2022.01); G06V 20/698 (2022.01); G06T 2207/10056 (2013.01); G06T 2207/30148 (2013.01);
Abstract

Methods and apparatus determine a location of a boundary of a given material in a sample, based on classification of reciprocal space images at respective positions. A diffraction image at a given position is classified to identify a material at that position. Imaging and classification at multiple positions can quickly and reliably find the boundary with sub-micron accuracy. Binary search provides speed-up. Classification is performed by neural network. The technique is suitable for distinguishing monocrystalline, polycrystalline, and amorphous silicon, high-Z materials (tungsten), or low-Z materials (carbon), among others. The technique integrates into automated workflows, with precise positioning of further imaging, probing, or milling operations based on the located boundary. Examples and variations are disclosed.


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