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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12577665 B1

PDFFull Text
Date of Patent:
Mar. 17, 2026

Filed:

Aug. 23, 2022

Next generation bonding layer for 3d heterogeneous integration

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Kandabara Tapily, Albany, NY (US);

Soo Doo Chae, Albany, NY (US);

Satohiko Hoshino, Albany, NY (US);

Hojin Kim, Albany, NY (US);

Adam Gildea, Albany, NY (US);

Assignee:

Tokyo Electron Limited, Tokyo, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Michael Lebentritt

Int. Cl.
CPC ...
H01L 23/00 (2006.01); C23C 16/40 (2006.01); C23C 16/455 (2006.01); C23C 16/56 (2006.01);
U.S. Cl.
CPC ...
H01L 24/80 (2013.01); C23C 16/403 (2013.01); C23C 16/45536 (2013.01); C23C 16/56 (2013.01); H01L 2224/80011 (2013.01); H01L 2224/8002 (2013.01); H01L 2224/80236 (2013.01); H01L 2224/80379 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01);
Abstract

Devices and methods for forming semiconductor devices are disclosed. The semiconductor device can include a plurality of semiconductor wafers. The plurality of semiconductor wafers can have a dielectric bonding layer disposed thereupon. The dielectric bonding layers can be treated to increase a bonding energy with other semiconductor wafers. A wafer having a treatment applied to a bonding layer can be bonded to another wafer.

Find Patent Forward Citations

Tapily, Kandabara. (2026). Next generation bonding layer for 3d heterogeneous integration (U.S. Patent No. 12577665). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12577665

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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