The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

May. 01, 2024
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

PO-Chi Wu, Zhubei City, TW;

Chai-Wei Chang, New Taipei City, TW;

Kuo-Hui Chang, Gueishan Township, TW;

Yi-Cheng Chao, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 64/01 (2025.01); H10D 64/66 (2025.01);
U.S. Cl.
CPC ...
H10D 64/017 (2025.01); H10D 64/015 (2025.01); H10D 64/018 (2025.01); H10D 64/667 (2025.01);
Abstract

Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a gate stack over a semiconductor substrate and a cap element over the gate stack. The cap element has an upper portion and a lower portion, and the upper portion is wider than the lower portion. The semiconductor device structure also includes a spacer element over a sidewall of the cap element and a sidewall of the gate stack.


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Wu, PO-Chi. (2026). Structure and formation method of semiconductor device structure (U.S. Patent No. 12575155). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12575155

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