The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

Feb. 03, 2025
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Shinichiro Kawakami, Koshi City, JP;

Yohei Sano, Koshi City, JP;

Tomoya Onitsuka, Koshi City, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/027 (2006.01); G03F 7/38 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
G03F 7/38 (2013.01); H01L 21/027 (2013.01); H01L 21/67103 (2013.01); H01L 21/68742 (2013.01);
Abstract

Provided is a technique that, when heat-treating a substrate including an exposed resist film formed on a surface of the substrate and exhibiting a change in solubility of an exposed portion or an unexposed portion in a liquid developer by reacting with water and being heated, is capable of promoting the change in the solubility. For this purpose, a heat treatment apparatus includes: a stageon which the substrate W is placed and heated; a lifting mechanismconfigured to relatively raise and lower the substrate W between a first position at which the substrate is placed on the stageand a second position spaced apart from the stage; and a gas supplyconfigured to supply a first gas having a humidity higher than that of an atmosphere in which the stageis provided, to the substrate W located at the second position before moving to the first position.


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