The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2026

Filed:

Jun. 22, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Young Ho Hwang, Hwaseong-si, KR;

Eun Seok Seo, Gwangmyeong-si, KR;

Jun O Park, Yongin-si, KR;

Jae Hong Lim, Pyeongtaek-si, KR;

Seok Heo, Busan, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B05C 11/10 (2006.01); G03F 7/16 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67248 (2013.01); B05C 11/1015 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01);
Abstract

Substrate processing apparatuses and methods of manufacturing a semiconductor device using the same may be provided. A substrate processing apparatus includes a heater in a support plate and comprising a first unit configured to heat a first portion of a substrate and a second unit configured to heat a second portion of a substrate, and processing circuitry configured to heat the heater in a transient section such that the first unit heats the first portion of the substrate to a first heating temperature, and the second unit heats the second portion of the substrate to a second heating temperature different from the first heating temperature, the transient section being a section before a temperature of the substrate reaches a steady state, a steady section being a section after the temperature of the substrate reaches the steady state.


Find Patent Forward Citations

Hwang, Young. (2026). Substrate processing apparatus and method of manufacturing semiconductor device using the same (U.S. Patent No. 12568790). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12568790

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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