Prediction of steady state heat maps for chip thermal analysis

Abstract

A method and apparatus of a device of predicting a heat map for a die model is described. In an exemplary embodiment, the device receives a die model for representing the die and a boundary condition applicable to the die, the die model including dimensions of the die. In addition, the device may include scaling the dimensions of the die model and the boundary condition, wherein the dimensions of the die model are scaled to a target die size, the scaled dimensions including a scaled die thickness. Furthermore, each trained die model including a die surface of the target die size, different trained die models having different die thickness, the plurality of trained die models trained under a plurality of boundary conditions, each trained die model having a plurality of decay curves associated with the plurality of boundary conditions. The method may additionally include determining a relationship between the scaled boundary condition and the plurality of boundary conditions. In addition, the method may include determining a decay curve for the die model according to a combination of decay curves associated with the plurality of boundary conditions for the one or more trained die models using the relationship. Furthermore, the method may include generating the die heat map based on the decay curve determined for the die model.