The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2026
Filed:
Aug. 31, 2021
Non-destructive coupon generation via direct write lithography for semiconductor process development
Tokyo Electron Limited, Minato-ku, JP;
Anthony R. Schepis, Albany, NY (US);
TOKYO ELECTRON LIMITED, Tokyo, JP;
Abstract
A method of processing a substrate that includes: depositing a photoresist layer over the substrate; performing a cyclic direct-write lithographic process using a direct-write lithography tool, the cyclic direct-write lithographic process including a plurality of cycles, each of the plurality of cycles including: exposing the photoresist layer to a patterned actinic radiation without using a photomask, defining one of a plurality of coupon regions, where the plurality of coupon regions are configured to generate a plurality of test samples on the substrate for evaluating process conditions of a fabrication process; exposing the one of the plurality of coupon regions; and performing the fabrication process on the one of the plurality of coupon regions.