The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2026
Filed:
Nov. 19, 2021
Intel Corporation, Santa Clara, CA (US);
Prashant Majhi, San Jose, CA (US);
Anand Murthy, Portland, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An integrated circuit structure includes a first interconnect layer including a first dielectric material. The first dielectric material has a first recess therein, the first recess having a first opening. The integrated circuit structure further includes a second interconnect layer above the first interconnect layer. The second interconnect layer includes a second dielectric material that has a second recess therein. The second recess has a second opening. In an example, at least a portion of the first opening of the first recess abuts and overlaps with at least a portion of the second opening of the second recess. In an example, a continuous conformal layer is on walls of the first and second recesses, and a continuous body of conductive material is within the first and second recesses.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile