The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2026
Filed:
Jan. 27, 2022
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Cornelius Brown Peethala, Slingerlands, NY (US);
Rudy J. Wojtecki, San Jose, CA (US);
Son Nguyen, Schenectady, NY (US);
Balasubramanian S. Pranatharthiharan, Watervliet, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02263 (2013.01); H01L 21/02118 (2013.01); H01L 23/5226 (2013.01);
Abstract
An exemplary semiconductor structure includes a semiconductor substrate; a plurality of metal lines on top of the semiconductor substrate, each line having a line width 5 nanometers or less: a plurality of dielectric features adjacent to the metal lines; and a plurality of metal vias on top of the metal lines. Out of a random sample of 1000 vias at least 950 vias are fully-aligned to corresponding metal lines.