The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Jan. 20, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Ming-Heng Tsai, Taipei, TW;

Chun-Sheng Liang, Changhua, TW;

Ta-Chun Lin, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 62/10 (2025.01); H10D 30/67 (2025.01); H10D 64/01 (2025.01);
U.S. Cl.
CPC ...
H10D 62/121 (2025.01); H10D 30/6735 (2025.01); H10D 64/017 (2025.01);
Abstract

Embodiments of the present disclosure provide a semiconductor device structure. In one embodiment, the semiconductor device structure includes a plurality of semiconductor layers vertically stacked over a substrate, a source/drain feature in contact with each of the plurality of the semiconductor layers, a gate electrode layer surrounding a portion of each of the plurality of the semiconductor layers, a source/drain contact disposed above the source/drain feature, a gate spacer disposed between the gate electrode layer and the source/drain contact, and an isolation structure extending through the gate electrode layer. The isolation structure includes a first portion having three sides covered by the gate electrode layer, the first portion having a top surface at a first elevation, and a second portion extended outwardly from the first portion, the second portion having a top surface at a second elevation that is lower than the first elevation.


Find Patent Forward Citations

Loading…