The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Jul. 20, 2023
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Kazuhito Yamada, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H05B 1/02 (2006.01); H05B 6/54 (2006.01); H05B 6/62 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32724 (2013.01); H01J 37/32541 (2013.01); H01J 37/32568 (2013.01); H05B 1/0233 (2013.01); H05B 6/54 (2013.01); H05B 6/62 (2013.01);
Abstract

A base disposed in a plasma processing chamber. An electrostatic chuck disposed on an upper portion of the base, the electrostatic chuck including a first part and a second part. A first heater electrode layer group including at least one heater electrode layer disposed in the first part. A second heater electrode layer group including at least one heater electrode layer disposed in the second part. A power source is electrically connected to the first heater electrode layer group and the second heater electrode layer group. A controller configured to periodically and sequentially supply DC current from the power source to heater electrode layers included in the first heater electrode layer group and heater electrode layers included in the second heater electrode layer group.


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Yamada, Kazuhito. (2026). Plasma processing apparatus and temperature controlling method (U.S. Patent No. 12562354). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12562354

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