The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Aug. 22, 2023
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yasuaki Noda, Koshi, JP;

Tadashi Nishiyama, Koshi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/027 (2006.01); B05D 1/00 (2006.01); G03F 7/00 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/26 (2006.01); G06T 7/00 (2017.01); G06T 7/60 (2017.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01); H01L 21/687 (2006.01); G01N 21/88 (2006.01); G01N 21/95 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0274 (2013.01); B05D 1/005 (2013.01); G03F 7/168 (2013.01); G03F 7/20 (2013.01); G03F 7/2028 (2013.01); G03F 7/26 (2013.01); G03F 7/70425 (2013.01); G06T 7/0008 (2013.01); G06T 7/60 (2013.01); H01L 21/6715 (2013.01); H01L 21/67173 (2013.01); H01L 21/67253 (2013.01); H01L 21/67288 (2013.01); H01L 21/681 (2013.01); H01L 21/68714 (2013.01); H01L 22/20 (2013.01); G01N 21/8806 (2013.01); G01N 21/9501 (2013.01); G01N 21/9503 (2013.01); G06T 2207/30148 (2013.01); H01L 22/12 (2013.01);
Abstract

A processing method including a step that takes an image of the end face of a reference substrate, whose warp amount is known, over the whole periphery thereof using a camera to obtain shape data of the end face of the reference substrate; a step that takes an image of the end face of a process substrate over the whole periphery thereof using a camera to obtain shape data of the end face of the process substrate; a step that calculates warp amount of the process substrate based on the obtained shape data; a step that forms a resist film on a surface of the process substrate; a step that determines the supply position from which an organic solvent is supplied to a peripheral portion of the resist film and dissolves the peripheral portion by the solvent supplied from the supply position to remove the same from the process substrate.


Find Patent Forward Citations

Noda, Yasuaki. (2026). Processing apparatus for forming a coating film on a substrate having a camera and a mirror member (U.S. Patent No. 12557608). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12557608

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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