The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2026
Filed:
Mar. 17, 2023
Intel Corporation, Santa Clara, CA (US);
Hong Seung Yeon, Chandler, AZ (US);
Mariano Phielipp, Mesa, AZ (US);
Yi Li, Chandler, AZ (US);
Minglu Liu, Chandler, AZ (US);
Robin Mcree, Chandler, AZ (US);
Yosuke Kanaoka, Chandler, AZ (US);
Gang Duan, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A method for real-time offset adjustment of a semiconductor die placement comprising: obtaining or receiving operational parameters of a die mounting tool in real-time, wherein the die mounting tool is configured for placing the semiconductor die on a panel; predicting an offset adjustment of the semiconductor die placement based on the operational parameters; and determining semiconductor die placement coordinates based on an original die placement and the offset adjustment.