The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Mar. 16, 2022
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Tadashi Obikane, Yamanashi, JP;

Fumito Kagami, Yamanashi, JP;

Kaori Arai, Yamanashi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/677 (2006.01); H01L 21/67 (2006.01); H01L 21/673 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67766 (2013.01); H01L 21/67253 (2013.01); H01L 21/67346 (2013.01); H01L 21/6838 (2013.01);
Abstract

A processing apparatus includes a pick configured to hold and transfer a substrate, a first suction pad disposed at a position in the pick where the first suction pad comes into contact with a concavely curved substrate, a second suction pad disposed at a position in the pick where the second suction pad comes into contact with a convexly curved substrate, a pressure sensor configured to detect a pressure in a first suction path connected to the first suction pad and a pressure in a second suction path connected to the second suction pad, and a controller configured to control suction operations by the first suction pad and the second suction pad based on a detection value of the pressure sensor.


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