The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Feb. 01, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Gulbagh Singh, Hsinchu, TW;

Tsung-Han Tsai, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 1/68 (2025.01); H01G 4/08 (2006.01); H01L 23/522 (2006.01); H10D 1/00 (2025.01);
U.S. Cl.
CPC ...
H10D 1/694 (2025.01); H01G 4/08 (2013.01); H01L 23/5223 (2013.01); H10D 1/042 (2025.01); H10D 1/043 (2025.01); H10D 1/696 (2025.01); H10D 1/716 (2025.01);
Abstract

A semiconductor device includes a first conductive material, a dielectric structure extending over a top surface of the first conductive material, the dielectric material having a first portion with a first thickness, and a second portion with a second thickness, and a third portion with a third thickness between the first thickness and the second thickness; and a second conductive material extending over the first portion of the dielectric structure. An oxygen-enriched portion of the second conductive material extends along a top surface and a sidewall of the second conductive material. A bottom surface and an interior portion of the second conductive material have an oxygen concentration which is larger than an oxygen concentration of a bottom surface and an interior portion of the second conductive material.


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