The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Jun. 21, 2022
Applicant:

Yangtze Memory Technologies Co., Ltd., Hubei, CN;

Inventors:

Tingting Gao, Hubei, CN;

Zhiliang Xia, Hubei, CN;

Xiaoxin Liu, Hubei, CN;

Changzhi Sun, Hubei, CN;

Xiaolong Du, Hubei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 43/27 (2023.01); H10B 41/27 (2023.01);
U.S. Cl.
CPC ...
H10B 43/27 (2023.02); H10B 41/27 (2023.02);
Abstract

The present application provides a three-dimensional memory and a fabrication method for the same. The method includes forming a storage stack structure on a substrate and forming a storage channel structure that penetrates the storage stack structure, forming a selection stack structure stacked on the storage stack structure and forming a selection channel structure that penetrates the selection stack structure and is connected to the storage channel structure. The width of the selection channel structure is smaller than the width of the storage channel structure on a plane parallel to the substrate and forming a TSG cut structure that penetrates the selection stack structure. The three-dimensional memory and the fabrication method for the same increases the process window for the TSG cut structure formed between the selection channel structures and improves the storage density.


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