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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12553834 B1

PDFFull Text
Date of Patent:
Feb. 17, 2026

Filed:

Jul. 07, 2023

Substrate inspection method

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Kihong Chung, Suwon-si, KR;

Kiwook Song, Suwon-si, KR;

Seungryeol Oh, Suwon-si, KR;

Chungsam Jun, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Muir Patent Law, PLLC

Primary Examiner:

Thanh Luu

Assistant Examiner:

Mai Thi Ngoc undefined Tran

Int. Cl.
CPC ...
G01N 21/95 (2006.01); G01B 15/02 (2006.01); G01N 21/21 (2006.01); G01N 21/29 (2006.01); G01N 21/88 (2006.01); G01N 23/2251 (2018.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); G01B 15/02 (2013.01); G01N 21/211 (2013.01); G01N 21/29 (2013.01); G01N 21/8851 (2013.01); G01N 23/2251 (2013.01); G01B 2210/56 (2013.01); G01N 2021/213 (2013.01); G01N 2021/8864 (2013.01); G01N 2223/6116 (2013.01); H01L 22/12 (2013.01);
Abstract

A substrate inspection method includes radiating light onto a substrate, extracting a spectrum representing an intensity of light according to a wavelength from a light reflected from the substrate, analyzing the extracted spectrum in units of each of an entire substrate, a shot, a chip, and a block, generating a spectrum distribution map indicating reflectivity for each wavelength band by using the analyzed spectrum, and extracting a weak point in the substrate based on the spectrum distribution map.

Find Patent Forward Citations

Chung, Kihong. (2026). Substrate inspection method (U.S. Patent No. 12553834). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12553834

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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