The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Oct. 07, 2020
Applicant:

Showa Denko Materials Co., Ltd., Tokyo, JP;

Inventors:

Takeshi Funatsu, Tagawa, JP;

Shingo Nakano, Tagawa, JP;

Naoko Mitsuishi, Tagawa, JP;

Kouji Yamada, Tagawa, JP;

Hiroaki Fujino, Tagawa, JP;

Hirofumi Shiokawa, Tagawa, JP;

Yoji Hirai, Tagawa, JP;

Assignee:

RESONAC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 44/42 (2006.01); B29C 44/02 (2006.01);
U.S. Cl.
CPC ...
B29C 44/428 (2013.01); B29C 44/02 (2013.01);
Abstract

An injection molded product includes a main body portion having a design surface and an opposite surface; and a projecting portion provided at a peripheral edge portion of the main body portion, and projecting out toward a side opposite from the design surface in a thickness direction of the main body portion, wherein a thickness A of the main body portion and a thickness B of the projecting portion satisfy a relationship of A≥B.


Find Patent Forward Citations

Funatsu, Takeshi. (2026). Injection molded product (U.S. Patent No. 12552073). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12552073

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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