The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Jun. 21, 2021
Applicant:
Showa Denko Materials Co., Ltd., Tokyo, JP;
Inventors:
Yu Aoki, Tokyo, JP;
Yoshimi Hamano, Tokyo, JP;
Teruaki Suzuki, Tokyo, JP;
Masahiro Hashimoto, Tokyo, JP;
Assignee:
RESONAC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/023 (2006.01); C08G 8/24 (2006.01); G03F 7/039 (2006.01); G03F 7/38 (2006.01); G03F 7/40 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0236 (2013.01); C08G 8/24 (2013.01); G03F 7/0395 (2013.01); G03F 7/38 (2013.01); G03F 7/40 (2013.01);
Abstract
The present disclosure relates a photosensitive resin composition containing (A) an alkali-soluble resin having an imide bond and a phenolic hydroxyl group and (B) a compound that generates acid by light, a patterned cured film using the photosensitive resin composition, a method for producing a patterned cured film, and a semiconductor element.
Aoki, Yu. (2026). Photosensitive resin composition, method for producing patterned cured film, patterned cured film and semiconductor element (U.S. Patent No. 12547074). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12547074
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile