The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2026
Filed:
Nov. 09, 2022
Applicant:
Samsung Sdi Co., Ltd., Yongin-si, KR;
Inventors:
Soo Yeon Sim, Suwon-si, KR;
Ji Ho Lee, Suwon-si, KR;
Yong Goog Kim, Suwon-si, KR;
Se Young Choi, Suwon-si, KR;
Ja Young Hwang, Suwon-si, KR;
Jeong Hee Kim, Suwon-si, KR;
Assignee:
SAMSUNG SDI CO., LTD., Yongin-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); C23F 1/18 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); C23F 1/18 (2013.01);
Abstract
A CMP slurry composition for polishing copper and a copper film polishing method using the same, the CMP slurry composition includes a solvent; an abrasive agent; and a compound including a structural unit represented by Formula 1 or a compound including a structural unit represented by Formula 2,