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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12538739 B1

PDFFull Text
Date of Patent:
Jan. 27, 2026

Filed:

Mar. 14, 2019

Post cmp cleaning apparatus and post cmp cleaning methods

Applicants:

Chen-hao Wu, Hsinchu, TW;

Chu-an Lee, Hsinchu, TW;

Chun-hung Liao, Taichung, TW;

Shen-nan Lee, Jhudong Township, Hsinchu County, TW;

Teng-chun Tsai, Hsinchu, TW;

Huang-lin Chao, Hillsboro, OR (US);

Chih-hung Chen, Hsinchu, TW;

Inventors:

Chen-Hao Wu, Hsinchu, TW;

Chu-An Lee, Hsinchu, TW;

Chun-Hung Liao, Taichung, TW;

Shen-Nan Lee, Jhudong Township, Hsinchu County, TW;

Teng-Chun Tsai, Hsinchu, TW;

Huang-Lin Chao, Hillsboro, OR (US);

Chih-Hung Chen, Hsinchu, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;

Attorney:

McClure, Qualey & Rodack, LLP

Primary Examiner:

Douglas Lee

Int. Cl.
CPC ...
H01L 21/67 (2006.01); B08B 1/12 (2024.01); B08B 1/20 (2024.01); B08B 1/34 (2024.01); B08B 3/02 (2006.01); B08B 3/04 (2006.01); B08B 3/08 (2006.01); B08B 3/10 (2006.01); H01L 21/02 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67219 (2013.01); B08B 1/12 (2024.01); B08B 1/20 (2024.01); B08B 3/022 (2013.01); B08B 3/041 (2013.01); B08B 3/08 (2013.01); B08B 3/102 (2013.01); H01L 21/02057 (2013.01); H01L 21/67046 (2013.01); H01L 21/67051 (2013.01); H01L 21/67092 (2013.01); H01L 21/68714 (2013.01); B08B 1/34 (2024.01);
Abstract

A post CMP cleaning apparatus is provided. The post CMP cleaning apparatus includes a cleaning stage. The post CMP cleaning apparatus also includes a rotating platen disposed in the cleaning stage, and the rotating platen is configured to hold and rotate a semiconductor wafer. The post CMP cleaning apparatus further includes a vibrating device disposed over the rotating platen. The post CMP cleaning apparatus further includes a solution delivery module disposed near the vibrating device and configured to deliver a cleaning fluid to the semiconductor wafer. The vibrating device is configured to provide the cleaning fluid with a specific frequency which is at least greater than 100 MHz while the rotating platen is rotating the semiconductor wafer, so that particles on the semiconductor wafer are removed by the cleaning fluid.

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Quick Actions:

Wu, Chen-Hao. (2026). Post cmp cleaning apparatus and post cmp cleaning methods (U.S. Patent No. 12538739). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12538739

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