The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2026

Filed:

May. 23, 2023
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Tomohiko Niizeki, Tokyo, JP;

Maju Tomura, Miyagi, JP;

Yoshihide Kihara, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32669 (2013.01); H01J 37/32568 (2013.01); H01J 2237/334 (2013.01);
Abstract

A substrate processing method includes: providing a substrate processing apparatus including a chamber, a substrate support that supports a substrate in the chamber, an upper electrode facing a center of the substrate, and a plurality of electromagnets arranged radially around the center of the upper electrode; selecting a polarity modification pattern to be used for the plurality of electromagnets during an etching; and generating plasma from a processing gas supplied into the chamber, and etching the substrate based on the polarity modification pattern.


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Niizeki, Tomohiko. (2026). Substrate processing method and substrate processing apparatus (U.S. Patent No. 12537171). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12537171

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