Conductive organic module for semiconductor devices and associated systems and methods

Abstract

Stacked semiconductor devices and associated systems and methods are disclosed herein. In some embodiments, the semiconductor device can include a package substrate and a stack of semiconductor dies carried by the package substrate. The stack of semiconductor dies includes a first die carried by the package substrate and a second die carried by the first die. The semiconductor device also includes an interconnect module carried by the package substrate adjacent the stack of semiconductor dies. The interconnect module includes a first end coupled the package substrate, a second end opposite the first end, a conductive via extending through a body of organic material from the first end to the second end. The first semiconductor die can is electrically coupled directly to the package substrate, while the second semiconductor die is electrically coupled to the package substrate through the second end of the interconnect module.