The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2026
Filed:
Aug. 16, 2022
Applicant:
United Microelectronics Corp., Hsinchu, TW;
Inventors:
Ming-Hua Tsai, Tainan, TW;
Hao Ping Yan, Tainan, TW;
Chin-Chia Kuo, Tainan, TW;
Wei Hsuan Chang, Tainan, TW;
Assignee:
United Microelectronics Corp., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/544 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/544 (2013.01); H01L 23/564 (2013.01); H01L 23/585 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/5446 (2013.01);
Abstract
A semiconductor structure including a substrate and protection structures is provided. The substrate includes a die region. The die region includes corner regions. The protection structures are located in the corner region. Each of the protection structures has a square top-view pattern. The square top-view patterns located in the same corner region have various sizes.