The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2026
Filed:
Oct. 27, 2021
Siltronic Ag, Munich, DE;
Thomas Stettner, Waging am See, DE;
SILTRONIC AG, Munich, DE;
Abstract
A characteristic thickness value of an edge of a wafer is determined, including at a notch position. The wafer is placed in a placement area, surrounded by a boundary, of susceptor for depositing an epitaxial layer. The characteristic thickness value at the notch position is checked to see if it differs by more than a percentage limit from the characteristic thickness value at an edge position having the greatest characteristic thickness value. The placing of the substrate wafer on the placement area is executed in such a way that a distance of the wafer from the boundary of the placement area is smaller at the edge position having the greatest characteristic thickness value or at the notch position than at other edge positions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile