The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2026
Filed:
Mar. 31, 2021
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); G02B 6/10 (2006.01); G02B 19/00 (2006.01); G02B 27/10 (2006.01); H01J 37/22 (2006.01); H01L 21/268 (2006.01); H01L 21/3065 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32724 (2013.01); G02B 6/10 (2013.01); G02B 19/0009 (2013.01); G02B 19/0047 (2013.01); G02B 27/106 (2013.01); H01J 37/22 (2013.01); H01L 21/268 (2013.01); H01L 21/3065 (2013.01); H01L 21/67069 (2013.01); H01L 21/67115 (2013.01); H01L 21/67248 (2013.01); H01L 21/6833 (2013.01); H01L 22/20 (2013.01); H01J 2237/2001 (2013.01); H01J 2237/3343 (2013.01);
Abstract
An apparatus includes a processing chamber, a substrate support in the processing chamber, a plasma source coupled to the processing chamber, and a plurality of heating devices arranged on the processing chamber. Each heating device is configured to emit laser beam on a substrate positioned on the substrate support to heat the substrate.