The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2026

Filed:

Jan. 26, 2021
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Kapil Umesh Sawlani, Sunnyvale, CA (US);

Michal Danek, Cupertino, CA (US);

Ravi Vellanki, San Jose, CA (US);

Sanjay Gopinath, Fremont, CA (US);

David G. Cohen, San Jose, CA (US);

Sassan Roham, San Ramon, CA (US);

Saravanapriyan Sriraman, Fremont, CA (US);

Benjamin Allen Haskell, Pleasanton, CA (US);

Lee J. Brogan, Newberg, OR (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/418 (2006.01); G05B 13/02 (2006.01);
U.S. Cl.
CPC ...
G05B 19/41885 (2013.01); G05B 13/0265 (2013.01); G05B 2219/32338 (2013.01); G05B 2219/33034 (2013.01); G05B 2219/45031 (2013.01);
Abstract

Methods, systems, and computer programs are presented for predicting the performance of semiconductor manufacturing equipment operations. One method includes an operation for obtaining machine-learning (ML) models, each model related to predicting a performance metric for an operation of a semiconductor manufacturing tool. Further, each ML model utilizes features defining inputs for the ML model. The method further includes an operation for receiving a process definition for manufacturing a product with the semiconductor manufacturing tool. One or more ML models are utilized to estimate a performance of the process definition used in the semiconductor manufacturing tool. Additionally, the method includes presenting, on a display, results showing the estimate of the performance of the manufacturing of the product. In some aspects, the use of hybrid models improves the predictive accuracy of the system by augmenting the capabilities of data-driven models with the reinforcement provided by the physics-based models.


Find Patent Forward Citations

Loading…