The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Jun. 18, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Linying Cui, Cupertino, CA (US);

James Rogers, Los Gatos, CA (US);

Rajinder Dhindsa, Pleasanton, CA (US);

Kartik Ramaswamy, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); H01J 37/305 (2006.01); H01J 37/32 (2006.01); H01L 21/3065 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32146 (2013.01); H01J 37/3053 (2013.01); H01J 37/32128 (2013.01); H01J 37/32137 (2013.01); H01J 37/32174 (2013.01); H01J 37/3255 (2013.01); H01J 37/32715 (2013.01); H01L 21/3065 (2013.01); H01L 21/6833 (2013.01); H01J 2237/2007 (2013.01); H01J 2237/334 (2013.01);
Abstract

Embodiments provided herein include an apparatus and methods for the plasma processing of a substrate in a processing chamber. In some embodiments, aspects of the apparatus and methods are directed to reducing defectivity in features formed on the surface of the substrate, improving plasma etch rate, and increasing selectivity of etching material to mask and/or etching material to stop layer. In some embodiments, the apparatus and methods enable processes that can be used to prevent or reduce the effect of trapped charges, disposed within features formed on a substrate, on the etch rate and defect formation. In some embodiments, the plasma processing methods include the synchronization of the delivery of pulsed-voltage (PV) waveforms, and alternately the delivery of a PV waveform and a radio frequency (RF) waveform, so as to allow for the independent control of generation of electrons that are provided, during one or more stages of a PV waveform cycle, to neutralize the trapped charges formed in the features formed on the substrate.


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