The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2026
Filed:
Jun. 21, 2023
Applicant:
Globalfoundries U.s. Inc., Malta, NY (US);
Inventors:
Ravi Prakash Srivastava, Clifton Park, NY (US);
Yusheng Bian, Ballston Lake, NY (US);
Vibhor Jain, Clifton Park, NY (US);
Assignee:
GlobalFoundries U.S. Inc., Malta, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/00 (2013.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4293 (2013.01); G02B 6/4243 (2013.01); G02B 6/4283 (2013.01);
Abstract
Embodiments of the disclosure provide a multi-substrate coupling for photonic integrated circuits (PICs). Structures of the disclosure may include a first substrate having a first surface. The first surface includes a groove therein. A second substrate has a second surface coupled to the first surface. The second substrate includes a cavity substantially aligned with the groove of the first surface, and a photonic integrated circuit (PIC) structure horizontally distal to the cavity.