The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2026
Filed:
Jun. 21, 2022
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Min-Feng Kao, Chiayi, TW;
Tzu-Hsuan Hsu, Kaohsiung, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A first side of a sensor wafer is bonded to a first side of a first logic wafer. The sensor wafer contains pixels configured to detect radiation that enters the sensor wafer through a second side of the sensor wafer opposite the first side. The first logic wafer contains circuitry configured to operate the pixels. The sensor wafer or the first logic wafer contains a protection diode. The first logic wafer is thinned from a second side of the first logic wafer opposite the first side. A through-substrate-via (TSV) is formed in the first logic wafer. The protection diode protects the sensor wafer or the first logic wafer from being damaged during the forming of the TSV. The second side of the first logic wafer is bonded to a second logic wafer. The sensor wafer is thinned from the second side of the sensor wafer.