The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Dec. 23, 2021
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Omkar Karhade, Chandler, AZ (US);
Nitin A. Deshpande, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 24/08 (2013.01); H01L 23/49816 (2013.01); H01L 23/49833 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/0213 (2013.01); H01L 2224/0224 (2013.01); H01L 2224/0801 (2013.01); H01L 2224/08148 (2013.01);
Abstract
Embodiments disclosed herein include semiconductor devices. In one embodiment, a die comprises a substrate, where the substrate comprises a semiconductor material. In an embodiment, a backend layer is over the substrate, where the backend layer comprises conductive routing. In an embodiment, the die further comprises a protrusion extending out from an edge of the substrate and the backend layer. In an embodiment, a fiducial is on a surface of the protrusion.