The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Nov. 06, 2024
Applicant:
Globalfoundries Singapore Pte. Ltd., Singapore, SG;
Inventors:
Qiying Wong, Singapore, SG;
Wanbing Yi, Singapore, SG;
Yudi Setiawan, Singapore, SG;
Vel Murugan Nagalinggam, Johor Bahru, MY;
Kemao Lin, Singapore, SG;
Assignee:
GlobalFoundries Singapore Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 21/76877 (2013.01); H01L 24/08 (2013.01); H01L 25/0657 (2013.01); H01L 23/53214 (2013.01); H01L 23/53261 (2013.01); H01L 24/80 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06565 (2013.01);
Abstract
A bonded semiconductor device includes a first semiconductor device, a second semiconductor device face bonded to the first semiconductor device, at least one metal plug in a middle of line layer of the first semiconductor device, and a through oxide via (TOV) coupled to the at least one metal plug and a metal line in a backside region of the first semiconductor device.