The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2025

Filed:

Dec. 15, 2022
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Masaki Kinoshita, Tokyo, JP;

Yoichi Shiokawa, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 11/06 (2006.01); B24B 37/005 (2012.01); B24B 37/013 (2012.01); B24B 37/20 (2012.01); B24B 49/02 (2006.01); B24B 49/12 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
G01B 11/0616 (2013.01); B24B 37/005 (2013.01); B24B 37/013 (2013.01); B24B 37/205 (2013.01); B24B 49/02 (2013.01); B24B 49/12 (2013.01); H01L 21/67092 (2013.01); H01L 21/67253 (2013.01); H01L 22/26 (2013.01); H01L 22/12 (2013.01);
Abstract

A film-thickness measuring method capable of substantially extending a wavelength range of a spectrum of reflected light from a workpiece, and accurately measuring a film thickness is disclosed. The film-thickness measuring method includes: pressing a workpiece against a polishing pad, while rotating a polishing table that supports the polishing pad, to polish the workpiece; during the polishing of the workpiece, directing light to the workpiece from a liquid-seal sensor and a transparent-window sensor disposed in the polishing table and receiving reflected light from the workpiece by the liquid-seal sensor and the transparent-window sensor; and determining a film thickness of the workpiece based on a spectrum of the reflected light from the workpiece.


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