The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
Jun. 24, 2022
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventor:
Robert D. Clark, Fremont, CA (US);
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/08 (2013.01); H01L 24/05 (2013.01); H01L 24/80 (2013.01); H01L 2224/05605 (2013.01); H01L 2224/05609 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05617 (2013.01); H01L 2224/0562 (2013.01); H01L 2224/05638 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2924/01007 (2013.01); H01L 2924/01008 (2013.01); H01L 2924/01016 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01034 (2013.01); H01L 2924/01052 (2013.01);
Abstract
A structure of a semiconductor package is disclosed. The structure includes a first substrate including a first interconnect structure. The structure includes a second substrate including a second interconnect structure, the second substrate bonded to the first substrate. The structure includes a connection pad interposed between the first interconnect structure and the second interconnect structure. The connection pad includes a material configured to switch between a high resistance state and a low resistance state. The material of the connection pad includes a phase change material.