The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2025

Filed:

Nov. 01, 2022
Applicant:

Fujian Jinhua Integrated Circuit Co., Ltd., Fujian, CN;

Inventors:

Guoguo Kong, Quanzhou, CN;

Meng Qi Zhuang, Quanzhou, CN;

Yun-Fan Chou, Quanzhou, CN;

Yu-Cheng Tung, Quanzhou, CN;

Shi-Wei He, Quanzhou, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10B 43/27 (2023.01); H01L 23/528 (2006.01); H10B 43/10 (2023.01);
U.S. Cl.
CPC ...
H10B 43/27 (2023.02); H01L 23/5283 (2013.01); H10B 43/10 (2023.02);
Abstract

The present disclosure provides a three-dimensional memory device and a method of fabricating the same, which includes a substrate, and a memory stack structure. The memory stack structure is disposed on the substrate, and includes a plurality of stack units sequentially stacked into a staircase shape, wherein each of the stack units has a stepped slope, the stepped slope of any one of the stack units disposed in a related lower position is less than the stepped slope of another one of the stack units disposed over the one of the stack units. Through this arrangements, the three-dimensional memory device may therefore obtain an optimized structural integrity, as well as improved component efficiency.


Find Patent Forward Citations

Loading…