The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2025
Filed:
Apr. 29, 2022
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Toshiki Naeki, Koshi, JP;
Kentaro Yamamura, Kumamoto, JP;
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05C 11/10 (2006.01); H01L 21/027 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67253 (2013.01); B05C 11/1005 (2013.01); H01L 21/0276 (2013.01); H01L 21/6715 (2013.01);
Abstract
A substrate processing apparatus for processing a substrate to be measured by a film thickness measurement device, includes: a heat treatment part configured to heat-treat a substrate coated with a coating film; and a fluid supply part configured to supply a fluid, which suppresses variations in a film thickness over time until the film thickness is measured by the film thickness measurement device, to the substrate during or after the heat-treatment by the heat treatment part.