The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2025
Filed:
Oct. 09, 2020
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Takayuki Ishii, Miyagi, JP;
Kazuya Nagaseki, Miyagi, JP;
Michishige Saito, Miyagi, JP;
Shota Kaneko, Miyagi, JP;
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 10/28 (2021.01); B23K 26/354 (2014.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B33Y 80/00 (2015.01); H01J 37/32 (2006.01); B22F 10/62 (2021.01); B22F 10/64 (2021.01); B22F 12/44 (2021.01); B22F 12/49 (2021.01); B22F 12/67 (2021.01); B33Y 30/00 (2015.01); G02B 26/10 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3255 (2013.01); B22F 10/28 (2021.01); B23K 26/354 (2015.10); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); H01J 37/32467 (2013.01); H01J 37/32495 (2013.01); H01J 37/32559 (2013.01); H01J 37/32633 (2013.01); H01J 37/32651 (2013.01); B22F 10/62 (2021.01); B22F 10/64 (2021.01); B22F 12/44 (2021.01); B22F 12/49 (2021.01); B22F 12/67 (2021.01); B22F 2301/052 (2013.01); B33Y 30/00 (2014.12); G02B 26/101 (2013.01);
Abstract
A member to be used in a substrate processing apparatus is provided. The member is formed of aluminum containing silicon, and the silicon has a particle diameter of 1 μm or less.